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发表于 2026-1-19 21:35:58
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Study of the protrusion of through-silicon vias in dual annealing-CMP processes for 3D integration
9 O3 p7 r9 m" m- y# [& N5 BTianjian Liu, Shizhao Wang, Fang Dong, Yang Xi, Yunpeng Zhang, Tao He, Xiang Sun & Sheng Liu : q8 B8 G9 i/ ?0 o! B8 J9 ?
Microsystems & Nanoengineering volume 11, Article number: 25 (2025)
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https://www.nature.com/articles/s41378-024-00797-z
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3 G0 Z2 m& T- y, k# FSheng Liu
5 d+ q# K% W" GSchool of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China
5 U; z/ N7 b3 Q1 F* ySchool of Power and Mechanical Engineering, Wuhan University, Wuhan, China |
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