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Study of the protrusion of through-silicon vias in dual annealing-CMP processes for 3D integration
* p0 X- s& Q- o+ k# NTianjian Liu, Shizhao Wang, Fang Dong, Yang Xi, Yunpeng Zhang, Tao He, Xiang Sun & Sheng Liu ; a. r# j9 w9 u7 O& S2 U# p
Microsystems & Nanoengineering volume 11, Article number: 25 (2025) 5 ^1 f. x7 c4 P z1 l- a# l
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https://www.nature.com/articles/s41378-024-00797-z
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$ X1 u. N- b% J* m' u* b, V" YSheng Liu% P% v& V- n7 A6 L2 ~' D
School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China
, M7 [( N2 y+ [* r6 v) a4 ?- BSchool of Power and Mechanical Engineering, Wuhan University, Wuhan, China |
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