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发表于 2026-1-19 21:35:58
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Study of the protrusion of through-silicon vias in dual annealing-CMP processes for 3D integration
* l0 C0 |& z& K. Z8 yTianjian Liu, Shizhao Wang, Fang Dong, Yang Xi, Yunpeng Zhang, Tao He, Xiang Sun & Sheng Liu
, W5 E. z! L* g, Q2 H" hMicrosystems & Nanoengineering volume 11, Article number: 25 (2025)
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https://www.nature.com/articles/s41378-024-00797-z
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; W) h* n) r9 @0 tSheng Liu9 f O6 f h" Z# y
School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China' y7 F' }; P Q1 E: @. d
School of Power and Mechanical Engineering, Wuhan University, Wuhan, China |
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